— The EPYC processor ecosystem for technical computing grows with solutions from major OEMs, ODMs, SIs, ISVs and the cloud —
SANTA
CLARA, Calif. —
March 21, 2022 — AMD (NASDAQ: AMD) announced the general
availability of the world’s first data center CPU using 3D die stacking, the 3rd Gen AMD EPYC™ processors with AMD 3D
V-Cache™ technology,
formerly codenamed “Milan-X.” Built on the “Zen 3” core architecture, these
processors expand the 3rd Gen EPYC CPU family and can deliver up to 66
percent performance uplift across a variety of targeted technical computing
workloads versus comparable, non-stacked 3rd Gen AMD EPYC
processors.1, 2
These
new processors feature the industry’s largest L3 cache,3 delivering the
same socket, software compatibility and modern security features as 3rd
Gen EPYC CPUs while providing outstanding performance for technical computing workloads
such as computational fluid dynamics (CFD), finite element analysis (FEA),
electronic design automation (EDA) and structural analysis. These workloads are
critical design tools for companies that must model the complexities of the physical
world to create simulations that test and validate engineering designs for some
of the world’s most innovate products.
“Building
upon our momentum in the data center as well as our history of industry-firsts,
3rd Gen AMD EPYC processors with AMD 3D V-Cache technology showcase
our leadership design and packaging technology enabling us to offer the
industry’s first workload-tailored server processor with 3D die stacking
technology,” said Dan McNamara, senior vice president and general manager,
Server Business Unit, AMD. “Our latest processors with AMD 3D V-Cache
technology provide breakthrough performance for mission-critical technical
computing workloads leading to better designed products and faster time to
market.”
“Customers’ increased adoption of data-rich applications requires a new approach to data center infrastructure. Micron and AMD share a vision of delivering full capability of leading DDR5 memory to high-performance data center platforms,” said Raj Hazra, senior vice president and general manager of the Compute and Networking Business Unit at Micron. “Our deep collaboration with AMD includes readying AMD platforms for Micron's latest DDR5 solutions as well as bringing 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology into our own data centers, where we are already seeing up to a 40% performance improvement over 3rd Gen AMD EPYC processors without AMD 3D V-Cache on select EDA workloads.”
Leading Packaging
Innovations
Cache size increases have
been at the forefront of performance improvement, particularly for technical
computing workloads relying heavily on large data sets. These workloads benefit
from increased cache size, however 2D chip designs have physical limitations on
the amount of cache that can effectively be built on the CPU. AMD 3D V-Cache technology
solves these physical challenges by bonding the AMD “Zen 3” core to the cache
module, increasing the amount of L3 while minimizing latency and increasing
throughput. This technology represents an innovative step forward in CPU design
and packaging and enables breakthrough performance in targeted technical
computing workloads.
Breakthrough
Performance
The world’s highest
performance server processors for technical computing,4 the 3rd
Gen AMD EPYC processors with AMD 3D V-Cache technology deliver faster
time-to-results on targeted workloads, such as:
·
EDA
– The 16-core, AMD EPYC™ 7373X CPU can deliver up to 66 percent faster simulations
on Synopsys VCS™, when compared to the EPYC 73F3 CPU.5
·
FEA
– The 64-core, AMD EPYC 7773X processor can deliver, on average, 44 percent more
performance on Altair® Radioss® simulation applications
compared to the competition’s top of stack processor.6
·
CFD
– The 32-core AMD EPYC 7573X processor can solve an average of 88 percent more
CFD problems per day than a comparable competitive 32-core count processor, while
running Ansys® CFX®.7
These performance capabilities
ultimately enable customers to deploy fewer servers and reduce power
consumption in the data center, helping to lower total cost of ownership (TCO),
reduce carbon footprint and address their environmental sustainability goals. For
instance, in a typical data center scenario running 4600 jobs per day of the Ansys®
CFX® test case cfx-50, using 2P 32-core AMD EPYC 7573X CPU based
servers can reduce the estimated number of servers required from 20 to 10 and lower
power consumption by 49 percent, when compared to the competition’s latest 2P 32-core
processor-based server. This ends up providing a projected 51 percent lower TCO
over three-years.
In other words, choosing 3rd
Gen AMD EPYC processors with AMD 3D V-Cache in this deployment would have the
environmental sustainability benefit of more than 81 acres of US forest per year
in carbon sequestered equivalents.8
3rd
Gen AMD EPYC processor with AMD 3D V-Cache Technology Product Chart
Cores |
Model |
# CCD |
TDP (W) |
cTDP range (W) |
Base Freq (GHz) |
Max Boost Freq (Up to GHz)9 |
L3 Cache (MB) |
DDR Channels |
Price (1KU) |
64 |
7773X |
8 |
280 |
225 – 280 |
2.20 |
3.50 |
768 |
8 |
$ 8,800 |
32 |
7573X |
8 |
280 |
225 – 280 |
2.80 |
3.60 |
768 |
8 |
$ 5,590 |
24 |
7473X |
8 |
240 |
225 – 280 |
2.80 |
3.70 |
768 |
8 |
$ 3,900 |
16 |
7373X |
8 |
240 |
225 – 280 |
3.05 |
3.80 |
768 |
8 |
$ 4,185 |
Industry-wide
Ecosystem Support
3rd
Gen AMD EPYC processors with AMD 3D V-Cache technology are available today from
a wide array of OEM partners, including, Atos, Cisco, Dell Technologies, Gigabyte,
HPE, Lenovo, QCT, and Supermicro.
3rd Gen AMD EPYC processors with AMD 3D V-Cache technology are also broadly supported by AMD software ecosystem partners, including, Altair, Ansys, Cadence, Dassault Systèmes, Siemens, and Synopsys.
Microsoft Azure HBv3 virtual machines (VMs) have now been fully upgraded to 3rd Gen AMD EPYC with AMD 3D V-Cache technology. According to Microsoft, HBv3 VMs are the fastest adopted addition to the Azure HPC platform ever and have seen performance gains of up to 80 percent in key HPC workloads from the addition of AMD 3D V-Cache compared to the previous HBv3 series VMs.